Used when printing the pattern with small and large aperturesü@at one time
. (Large ones need enough amount of paste, but small ones need less for
avoiding the ügbridgeüh, ügsolder ball spreadingüh problems.)ü@
Or when PCB has some parts of ô╩ü@, used as covering ( avoiding contact) so that flat contact with stencil and PCB can be obtained.
(remaining small area ô╩)
Adequate amount of paste for both large devices and small devices.
Exüjthicknessüücombination of 0.25ü^0.15mm
Small area step down
By making specified thickness in fine pitch pattern area, proper amount of paste can be supplied to the area.
Features of step down stencil
Electro-forming, laser-cutting, chemical etching stencil
1day extra adding to normal schedule for each stencil