BON MARK Co.,Ltd
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STEP-DOWN Stencil


Used when printing the pattern with small and large apertures@at one time . (Large ones need enough amount of paste, but small ones need less for avoiding the gbridgeh, gsolder ball spreadingh problems.)@
Or when PCB has some parts of ʁ@, used as covering ( avoiding contact) so that flat contact with stencil and PCB can be obtained.


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Overall-step down
(remaining small area
)
Adequate amount of paste for both large devices and small devices.

section
Exjthicknesscombination of 0.25^0.15mm

Small area step down
By making specified thickness in fine pitch pattern area, proper amount of paste can be supplied to the area.

Features of step down stencil


application

Electro-forming, laser-cutting, chemical etching stencil

Lead time

1day extra adding to normal schedule for each stencil
Size spec DepthFMin10m@Depth AccuracyF}10m