Features

It enables to finish both solder applications in one printing process and shorten the tact time.

Cavity-back PCB illustration

The cavity-back PCB is characterized by its uneven surface

Conventional printing method of cavity-back PCB by the standard stencil

The standard stencil is flat; hence, we need to divide solder paste transcription into two processes

1.First process: Stencil printing on the PCB surface

Stencil printing by the printing machine

2.Second Process: Apply solder paste on cavity surface by the dispenser machine

Use of dispenser machine, manual printing etc.

3.Mounting ( Pick and Place ) and reflow

4.Demerits of conventional printing method by the standard stencil

• It requires two processes
• It also requires two machines and burdens big machine spaces
• The limitation of precise solder application by the dispenser process
• longer tact time for manufacture

New method by Bon Mark Cavity stencil

Our cavity stencil enables you to print both PCB surface and cavity part at once by the printing machine

Cavity stencil printing by the printing machine

Stencil release

Mounting ( Pick and Place ) and reflow

Merits of Bon Mark cavity stencil application

• It enables to finish both solder applications during one printing process
• It requires only printing machines and saves the factory space
• It may achieve very precise pattern printing on the cavity surface rather than dispensing
• It enables to shorten tact time