Features

• Our photolithographic technologies, such as exposure, development and stripping achieve high-quality and precise stencil apertures.
• Precise and acurate aperture shape
• Smooth opening wall surface
• intentional rough surface finish on stencil backside for excellent stencil release
• High cost performance can be achieved for high density patterns with a huge number of opening apertures.

Applications

• C4 pre-solder bump printing for IC substrate and wafer
• Flux printing for IC substrate ( IC package ) and wafer
• VIA hole filling for ceramic capaciters
• Printing for ultra-small component modules
• Sieving Stencils for solder ball inspection and sorting
• Vapor deposition and vacuum evaporation stencils for OLED
• Widely used in various applications.