Features

• We are capable of forming a solder ball mounting stencil with unique rounded-shaped posts to prevent flux adhesion, and this stencil structure has been patented, and other related patents are currently being applied for worldwide.
• Our ball mounting stencils feature a unique patented post shape that prevents post chipping and improves flux cleaning performance, uniformity of stencil thickness, flatness and horizontal parallelism of stnecil surfaces.

Ball Mounting Stencil for Wafers

Features

• We are capable of designing various posts (or studs) arrangements which prevent flux adhesion in response to fine-pitch pattern configurations.