Features

• Fine and stable aperture shapes and wall surfaces achieved through our fiber laser processing.
• Sharp aperture edges enable ideal solder filling and facilitate stable solder paste deposition.
• Meeting customers’ requirements for increased solder transcription by adjusting the roughness of opening wall.
• Our Nano-coating (BM-S coating) treatment on the inner walls of apertures in order to increase solder volume and prevent solder paste smudge and solder spreading.

Basic Material

• Maximum processing area: 760 mm × 580 mm (may vary depending on metal foil thickness)
• Minimum foil thickness: 20 µm (available in 10 µm increments from 20 µm to 200 µm except 170 and 190 µm)