More and more users are switching to metal squeegees instead of rubber squeegees for fine-pitch
pattern printing. By applying our unique dimple processing and special coating to our metal squeegees,
we have achieved improved solder paste rolling performance and solder filling into stencils’ apertures.

Feature

• Our dimples processing facilitates smooth solder paste transcription by activating solder particles movement, enhancing the solder paste fluidity and maintaining optimum viscosity of solder paste.
• Stabilizing the solder paste’s fluidity and rolling performance improves solder filling ability into fine-pitch stencil’s apertures.
• Stable solder filling can be achieved even with a relatively small amount of solder paste and enabling to minimize the amount of solder paste discarded.
• The water-repellent coating makes it easy to clean the solder paste after using a squeegee.