Made by electro-plating method and thickness available as
requested .（ＭＡＸ０．２５ｍｍ）
Its material is Nickel Alloy
suitable for 0.30mm-0.50mm fine pitch QFP,BGA(CSP) or 0603 {mm}( by inch
: 0201 ) ,0402[ｍｍ] (by inch: : 01005 )chip
Its very smooth inside aperture wall will enhance the paste release
Product specifications
【characteristic】
Applicable for fine-pitch QFP pattern
Good performance of paste release！
Flat and smooth aperture inside wall！
Any thickness available (within capable spec)！
【type of stencil】
Material
Nickel Alloy
Method
Electro-Forming
※for above stencil, option such as BM-MASK process (applying for PAT.)
,Teflon Ｐｌａｔｉｎｇ process can be done if requested.
